Multipurpose and programmable pad for an integrated circuit

ABSTRACT

A multi-port SERDES transceiver includes multiple parallel and serial ports, and the flexibility to connect any one of the parallel or serial ports to another parallel or serial port. The ports include programmable pads that are capable of supporting multiple different data protocols, timing protocols, electrical specifications, and input-output functions. A management data IO pad also enables the transceiver to support different electrical requirements and data protocols at the same time. The substrate layout of the transceiver is configured so that the parallel ports and the serial ports are on the outer perimeter. A logic core is at the center, where the logic core operates the serial and parallel data ports, and the bus that connects the data ports. The bus can be described as a “ring” structure (or donut “structure”) around the logic core, and is configured between the logic core and the data ports.

CROSS-REFERENCE TO RELATED APPLICATIONS

This patent application is a continuation of U.S. patent applicationSer. No. 10/694,729, filed Oct. 29, 2003, now U.S. Pat. No. 7,664,888,which claims the benefit of U.S. Provisional Application No. 60/421,780,filed Oct. 29, 2002, each of which is incorporated herein by referencein their entirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to serializer/deserializerintegrated circuits with multiple high-speed data ports, and moreparticularly to a serializer and deserializer chip that includes thefunctionality to switch between multiple high-speed data ports.

2. Related Art

High-speed data links transmit data from one location to another overtransmission lines. These data links can include serializer data links(i.e. SERDES) that receive data in a parallel format and convert thedata to a serial format for high-speed transmission, and deserializerdata links (i.e., SERDES) that receive data in a serial format andconvert the data to a parallel format. SERDES data links can be used forcommunicating data through a backplane in a communications system (e.g.,Tyco Backplane 16 or 30-inch trace).

In a high-speed back plane configuration, it is often desirable toswitch between multiple SERDES links. In other words, it is oftendesirable to switch between any one of multiple SERDES links to anotherSERDES link, and to do so in a low power configuration on a singleintegrated circuit.

BRIEF DESCRIPTION OF THE DRAWINGS/FIGURES

The accompanying drawings, which are incorporated herein and form partof the specification, illustrate the present invention and, togetherwith the description, further serve to explain the principles of theinvention and to enable a person skilled in the pertinent art(s) to makeand use the invention. In the drawings, like reference numbers indicateidentical or functionally similar elements. Additionally, the leftmostdigit(s) of a reference number identifies the drawing in which thereference number first appears.

FIG. 1 illustrates a multi-port SERDES transceiver chip according to anembodiment of the present invention.

FIG. 2 illustrates a substrate layout of a multi-port SERDES transceiverchip according to an embodiment of the present invention.

FIG. 3 illustrates sections of a bus on a multi-port SERDES transceiverchip according to an embodiment of the present invention.

FIG. 4 illustrates path lengths of wires in a bus on a transceiver chipaccording to an embodiment of the present invention.

FIG. 5 illustrates path lengths of wires in a bus on a transceiver chipaccording to another embodiment of the present invention.

FIG. 6 illustrates a substrate layout of the multi-port SERDEStransceiver chip according to another embodiment of the presentinvention.

FIG. 7 illustrates a control system for programming a transceiver padaccording to an embodiment of the present invention.

FIG. 8 illustrates a pad timing controller according to an embodiment ofthe present invention.

FIG. 9 illustrates a power bus connection for a multi-port SERDEStransceiver chip according to an embodiment of the present invention.

FIG. 10 illustrates an operational flow for configuring a transceiverpad to support a specified data protocol according to an embodiment ofthe present invention.

FIG. 11 illustrates an operational flow for reconfiguring an outputtransceiver pad to function as an input according to an embodiment ofthe present invention.

FIG. 12 illustrates an operational flow for programming a transceiverpad to perform Iddq testing according to an embodiment of the presentinvention.

FIG. 13 illustrates an operational flow for changing a timing protocolfor a transceiver pad according to an embodiment of the presentinvention.

FIG. 14 illustrates an operational flow for configuring a transceiverpad to comply with a specified electrical specification according to anembodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 illustrates a multi-port SERDES transceiver 100 according toembodiments of the present invention. The SERDES transceiver 100includes multiple parallel ports and serial ports, and includes theflexibility to connect any one of the parallel ports to another parallelport or to a serial port, or both. Furthermore, the multi-porttransceiver chip 100 can connect any one of the serial ports to anotherserial port or to one of the parallel ports.

More specifically, the SERDES transceiver chip 100 includes two paralleltransceiver ports 102 a-102 b and four serial transceiver ports 104a-104 d. Other configurations having a different number of ports couldbe used. The parallel transceiver ports 102 a-102 b transmit and receivedata in a parallel format. The parallel transceiver ports 102 a-102 bcan be XGMII parallel ports, for example, where the XGMII transceiverprotocol is known to those skilled in the relevant art(s). Each XGMIIport 102 can includes 72 pins, for example, operating at 1/10 the datarate of the serial ports 104.

The four serial ports 104 a-d can be XAUI serial ports, and transmit andreceive data in a serial format. Each serial port 104 can be a quadserial port having four serial data lines using the XAUI protocol thatis known to those skilled in the relevant art(s). In embodiments of theinvention, the serial ports 104 can operate at data rates of 3.125 GHz,2.5 GHz, and 1.25 GHz. In other words, transceiver chip 100 is amulti-rate device. However, the XAUI data rates above are effectivelyquadrupled since there are four serial data lines in each serial port104. The serial ports 104 can be further described as a 10-Gigabitextension sub-layer (XGXS). In embodiments, the serial data ports 104are differential.

The parallel ports 102 and the serial ports 104 are linked together by abus 106. The bus 106 enables data to travel between all the ports 102and 104. More specifically, the bus 106 enables data to travel from oneparallel port 102 to another parallel port 102, and to travel from oneparallel port 102 to a serial port 104. Multiplexes 108 connect the bus106 to the parallel ports 102 and to the serial ports 104. The serialport 104 performs a parallel to serial conversion when receivingparallel data that is to be sent out serial. Likewise, the bus 106enables data to travel from one serial port 104 to another serial port104, and to travel between a serial port 104 and a parallel port 102.The parallel port 102 performs a serial-to-parallel conversion whenreceiving serial data that is to be sent out in parallel. The multi-portSERDES transceiver 100 is highly flexible in being able to connectmultiple parallel ports 102 to multiple serial ports 104, and viceversa.

In embodiments, the SERDES transceiver chip 100 can be implemented on asingle CMOS substrate. For example, the SERDES transceiver chip 100 canbe implemented using a low power 0.13-micron CMOS process technology,which lends itself to higher levels of integration and application.

The transceiver 100 enables dual unit operation, where one parallel port102 is paired up with two of the serial ports 104, and the otherparallel port 102 is paired up with the other two serial ports 104. Forexample, parallel port 102 a can be paired with serial ports 104 a and104 b. Likewise, the parallel port 102 b can be paired with serial ports104 c and 104 d. However, there is complete selectivity of the portsthat are grouped together for dual unit operation. For example, parallelport 102 a can be paired with either serial ports 104 a and 104 b, orserial ports 104 c and 104 d. In a backplane configuration, thisprovides flexibility to connect a parallel port to one or more serialports for redundancy.

The transceiver 100 also includes a packet bit error rate tester (BERT)112. The packet BERT 112 generates and processes packet test data thatcan be transmitted over any of the serial ports 104 or parallel ports102 to perform bit error testing. Any type of packet data can begenerated to perform the testing and at different data rates. Forexample, the packet BERT 112 can generate packet data that can be usedto test the SERDES data link. As such, the packet BERT 112 provides abuilt-in self test for the SERDES data link. The packet BERT 112generates test data that is sent over one or more of the serial ports104 using the bus 106 to perform the bit error rate testing of theSERDES data link. Likewise, the packet BERT 112 can capture test datareceived over any one of the serial ports 104 or parallel ports 102using the bus 106 for comparison with test data that was sent out. A biterror rate can then be determined based on this comparison.

In one embodiment, the packet BERT 112 is RAM-based so that the testdata is stored and compared in a RAM memory to perform the bit errorrate test. In another embodiment, the packet BERT 112 is logic-based sothat the test data is generated by a logic function, and transmittedacross a SERDES link. Upon receipt back, the test data is re-generatedby the logic packet BERT 112, for comparison with the original test datathat was sent over the SERDES data link. A RAM packet BERT 112 is moreflexible than a logic packet BERT 112 because there is no limitation onthe data that can be stored in the RAM packet BERT 112. However, a logicpacket BERT 112 is more efficient in terms of substrate area because aRAM occupies more area than a logic circuit.

Since the packet BERT 112 shares the same bus 106 with the serial ports104, the packet BERT 112 can monitor (or “snoop”) between the serialports 104. In other words, if data is being transmitted from one serialport 104 to another serial port 104, the packet BERT can capture andstore a portion of this data for bit error testing. In one embodiment,the packet BERT 112 “blindly” captures data being sent from one serialport 104 to another serial port 104. In another embodiment, the packetBERT 112 starts capturing data after a particular byte of data istransmitted. In another embodiment, the packet BERT 112 starts capturingdata after an error event occurs.

The SERDES transceiver chip 100 also includes the ability to includeother optional logic blocks 114 that are not necessary for the operationof the SERDES transceiver. In other words, these could becustomer-driven logic blocks or some other type of logic block. Theseoptional logic blocks 114 can transmit and receive data over the serialports 104 or parallel ports 102 using the bus 106. The packet BERT 112and the optional blocks 114 connect to the bus 106 using themultiplexers 110.

The SERDES transceiver chip 100 also includes a management interface 116that enables the configuration of the portions (parallel ports 102,serial port 104, packet BERT 112, and optional logic blocks 114) of thetransceiver chip 100. In an embodiment, the management interface 116 isconfigured to be compatible with both IEEE 802.3™ clause 45 and the IEEE802.3™ clause 22 management standards. The management interface 116includes two pads 117 that enable two different management chips toprogram and control the portions of the transceiver chip 100. Forexample, one management chip connected to pad 117 a could control theparallel port 102 a and the serial ports 104 a and 104 b, and anothermanagement chip connected to pad 117 b could control the parallel port102 b and the serial ports 104 c and 104 d. The quantity of pads 117 andmanagement chips are provided for illustrative purposes. A greater orsmaller quantity of pads 117 and management chips can be included asdetermined by the system designer.

FIG. 2 illustrates the substrate layout 200 for the SERDES transceiver100 according to embodiments of the present invention. The substratelayout 200 is configured to minimize the substrate area of thetransceiver 100, and efficiently provide the port interconnectionsdescribed above.

The substrate layout 200 is configured so that the parallel ports 102a-102 b and the serial ports 104 a-104 d are on the outer perimeter ofthe substrate layout 200, as shown. A logic core 202 is at the center ofthe substrate layout 200, where the logic core 202 operates the bus 106,serial ports 104, and parallel 102 ports. The management interface 116,the packet BERT 112, and the optional logic blocks 114 a-114 c areadjacent to the logic core 202 as shown. The bus 106 can be described asa “ring” structure (or donut “structure”) around the logic core 202, andplaced in between the logic core 202 and the parallel ports 102 andserial ports 104 that occupy the parameter of the substrate layout 200.Furthermore, the ring structure of the bus 106 also provides efficientcommunication between the logic core 202 and the various ports 102 and104. Furthermore, the ring structure of the bus 106 also providesefficient communication between the management interface 116, the packetBERT 112, the optional logic blocks 114, and the various ports 102 and104.

The bus 106 is illustrated as eight sections 106 a-106 g for ease ofillustration. Each section provides an interface to the respective ports102 or 104 that are adjacent to the respective sections.

FIG. 3 represents one of the eight sections 106 a-106 g of the bus 106according to embodiments of the present invention. Each section of thebus 106 can be represented as two paths 308 and 310. Data enters the bus106 through a buffer 302 and proceeds to its destination along the path308 and through the buffers 304. Once on the bus 106, data passes fromone section to another section of the bus 106 using the path 310 andpassing through the buffers 312. The mux 306 represents data passingfrom the bus 106 to a functional block, such as a parallel port 102,serial port 104, or packet BERT 112. The actual wires and buffers on thebus 106 are matched to minimize signal distortion.

In embodiments, the data wires in the bus 106 are deposited on thesubstrate for substrate layout 200 in a particular fashion. Namely, apower or ground is placed between adjacent (or near by) data wires.Furthermore, adjacent data wires on the bus 106 are placed on twoseparate layers. Therefore, a power or ground will be above or below adata wire, and adjacent to a data wire. Therefore, two nearby data wireswill not be located directly adjacent to one another, but instead willbe positioned diagonally to each other, thereby reducing cross-talk.

FIG. 4 further illustrates an example layout of the bus 106. The wires402 between parallel ports 102 and serial ports 104 are configured tohave the same path lengths. In other words, wires 402 a-d are depositedso as to have the same path length so as to reduce signal distortion.

FIG. 5 illustrates another embodiment of the bus 106 in the substratelayout 200. Whereas FIG. 4 depicted only four wires 402 a-402 d forconnecting one port (102 or 104) to an adjacent port (102 or 104), FIG.5 depicts a plurality of wires 402 a-402 n for connecting two adjacentports (102 and 104). The total number of wires 402 a-402 n is determinedby the design of the chip 100.

In an embodiment, multi-port SERDES transceiver 100 is programmable tosupport different data protocols, including, but not limited to, theXGMII protocol, the Ten Bit Interface (TBI) protocol, the Reduced TBI(RTBI) protocol, and the like. Transceiver 100 is also programmable tosupport different electrical specifications, including, but not limitedto, the High Speed Transistor Logic (HSTL) electrical specification, theSolid State Track Link (SSTL) electrical specification, the Low VoltageTransistor Transistor Logic (LVTTL) electrical specification, and thelike. The present invention includes methodologies or techniques forsending control signals to configure the parallel ports 102 a-102 b tosupport a designated data protocol. This can be explained with referenceto FIG. 6, which illustrates a substrate layout 600 for the SERDEStransceiver 100 according to another embodiment of the presentinvention. Substrate layout 600 includes a plurality of pads 604 a-604 dthat are part of the four serial ports 104 a-104 d. In other words, eachserial port 104 includes a plurality of pads 604. As shown, serial port104 a includes a plurality of pads 604 a. Serial port 104 b includes aplurality of pads 604 b. Serial port 104 c includes a plurality of pads604 c. Serial port 104 d includes a plurality of pads 604 d.

Substrate layout 600 also includes a plurality of pads 602 a-602 drepresenting two parallel ports 102 a-102 b. Pads 602 a-602 b are partof parallel port 102 a, and pads 602 c-602 d are part of parallel port102 b. Pads 602 a and pads 602 d are input pads. As such, transceiver100 receives data and control signals at input pads 602 a and input pads602 d. Pads 602 b and 602 c are output pads that enable transceiver 100to transmit data and control signals. In an embodiment, each group ofpads 602 includes forty-four individual pads. Forty of the pads arededicated to sending or receiving data signals, and four of the pads arededicated to sending or receiving control signals (e.g., clock signals).The total quantity of pads can be increased or decreased as determinedby the system designer. Likewise, the ratio of data-to-control pads canalso be increased or decreased to meet system requirements as determinedby the designer.

Substrate layout 600 also includes a plurality of management datainput/output (MDIO) pads 606 a-606 d. MDIO pads 606 a-606 d representanother embodiment of pads 117 a-117 b, which are described above withreference to FIG. 1. MDIO pads 606 a-606 d are programmable to configurepads 602 a-602 d and 604 a-604 d for compliance with a designatedelectrical specification and/or data protocol. The electricalspecification and/or data protocol is configured via an external pull-upor pull-down resistor(s) at the designated control pad. The electricalspecifications include IEEE 802.3™ clause 45, IEEE 802.3™ clause 22, orthe like. As shown, MDIO pads 606 a control pads 602 a-602 b, MDIO pads606 b control pads 604 c-604 d, MDIO pads 606 c control pads 602 c-602d, and MDIO pads 606 d control pads 604 a-604 b. As discussed above withreference to FIG. 1, in an embodiment, MDIO pads 606 receiveinstructions from one or more management chips. These instructions areexecuted by the MDIO pads 606 to configure transceiver 100 and parallelports 102 a-102 b to be compatible with the designated electricalspecification. As discussed, in an embodiment, one management chip isprovided to instruct all MDIO pads 606 and their associated IO pads 602and/or 604. In another embodiment, a distinct management chip isprovided to instruct each MDIO pad 606 and its associated 10 pads 602and/or 604. In another embodiment, a separate management chip isprovided to instruct a subset of MDIO pads 606 and their associated IOpads 602 and/or 604.

The serial IO pads 604 a-604 d, parallel IO pads 602 a-602 d, and MDIOpads 606 a-606 d are positioned to provide rotational symmetry forsubstrate layout 600. Therefore, if the transceiver 100 is rotated 180degrees, the serial and parallel ports can be connected to anothercommunications device without impeding the performance of transceiver100, or having to reconfigure either device. The symmetrical layout ofthe components also allows efficiencies to be gained when thetransceiver is being connected. For instance, while wire-bonding thepads (i.e., 604 a-604 d, 602 a-602 d, and 606 a-606 d), a technicianonly needs to design or configure equipment to wire-bond half of thetransceiver 100 since the other half would have identical dimensions.

As discussed, the pads 602 a-602 d for the parallel ports 102 a-102 bare programmable to support multiple different standards, protocols,and/or functions. FIG. 7 illustrates a block diagram for logic orcircuitry for a pad control system 700 for programming each pad 602according to an embodiment of the present invention. Pad control system700 includes one or more programmable control registers 702, a padtiming controller 704, input controller 706, output controller 708, andconfiguration control logic 710. Configuration control logic 710 isresponsive to various control signals, which are executed to program pad602 such that it is capable of supporting a designated protocol. Inputcontroller 706 sends an input control signal 722 to configurationcontrol logic 710 to program pad 602 to receive input. Output controller708 sends an output control signal 724 to configuration control logic710 to program pad 602 to send output.

Programmable control registers 702 include five types of control signalsfor programming pad 602. A system operator inputs these control signals,but in an embodiment, the control signals are supplied by a computersystem (not shown). The five control signals include a reset message712, an Iddq message 714, a power down message 716, a pad type message718, and a delay select message 720.

A reset message 712 is released to instruct pad 602 to change itsoriginally designated function (i.e., input or output). For example, ifpad 602 is originally designated as an output pad, the pad 602 isreconfigured to operate as an input pad upon receipt of a reset message712. In FIG. 7, pad 602 is an output pad. Therefore, reset message 712is only delivered to input controller 706 to enable pad 602 to switch toreceiving input.

An Iddq message 714 is released to implement Iddq testing to measure thequiescent supply current of transceiver 100. When executed, Iddq message714 places the path across a pad 602 in a quiescent state to measure theleakage current. As shown, Iddq message 714 is sent to input controller706, output controller 708, and/or configuration control logic 710 forimplementation.

A power down message 714 is released to suspend the operations ofportions of pad 602. If power down message 714 is delivered to inputcontroller 706, pad 602 no longer receives input. If power down messageis delivered to output controller 708, pad 602 no longer outputs data orcontrol messages. If power down message 714 is delivered toconfiguration control logic 710, the muxing and timing operations of thecontrol logic 710 are suspended.

PAD type message 718 specifies the data protocol and electricalspecification, and instructs configuration control logic 710 toimplement the specified data protocol and electrical specification. Asdiscussed, the data protocol includes the XGMII, TBI, RTBI protocols,and the like. The electrical specification includes HSTL, SSTL, andLVTTL electrical specifications, and the like.

Delay select message 720 specifies the path delay for input and output.The parameter specified in the delay select message 720 enables thesystem operator, or the like, to adjust the delay between input andoutput at each pad 602 for better system performance.

As discussed above, the present invention allows transceiver 100 to beprogrammed to support different data protocols. Referring to FIG. 10,flowchart 1000 represents the general operational flow for configuring aprogrammable pad 602 to support a designated data protocol, according toan embodiment of the present invention.

The control flow of flowchart 1000 begins at step 1001 and passesimmediately to step 1003. At step 1003, protocol instructions for adesignated data protocol are specified. Referring back to FIG. 7, thespecified protocol instructions are placed in programmable controlregisters 702.

At step 1006, a control signal carrying the protocol instructions arereleased to program a pad 602. Referring back to FIG. 7, the controlsignal is shown as PAD type message 718, which is received byconfiguration control logic 710.

At step 1009, the control signal (i.e., PAD type message 718) isexecuted to implement the specified data protocol. At step 1012, anoutput control signal 724 or input control signal 722 is sent toconfiguration control logic 710 to instruct the programmable pad 602 tofunction as an output or input. At step 1015, pad 602 transmits orreceives in accordance with the specified data protocol. Afterwards, thecontrol flow ends as indicated at step 1095.

Referring back to FIG. 7, pad 602 is programmed to function as anoutput. However, pad 602 can be reconfigured to function as an input.Referring to FIG. 11, flowchart 1100 provides an example of a generaloperational flow for reconfiguring an output programmable pad 602 tofunction as an input.

The control flow of flowchart 1100 begins at step 1101 and passesimmediately to step 1103. At step 1103, pad 602 is instructed to ceasefunctioning as an output. Referring back to FIG. 7, power down message716 is sent to output controller 708, which as a result, stops sendingoutput control signal 724.

At step 1106, input operations are initiated at pad 602. Referring backto FIG. 7, reset message 712 is sent to input controller 706 to initiatethe operations. At step 1109, input control signal 722 is sent toconfiguration control logic 710. At step 1112, configuration controllogic 710 executes the input control signal 722 to configure pad 602 tostart receiving input. Afterwards, the control flow ends as indicated atstep 1195.

As discussed above, programmable control registers 702 also release anIddq message 714 to implement Iddq testing. Referring to FIG. 12,flowchart 1200 provides an example of a general operational flow forprogramming pad 602 to perform Iddq testing.

The control flow of flowchart 1200 begins at step 1201 and passesimmediately to step 1203. At step 1203, Iddq message 714 is released toeither input controller 706 or output controller 708, depending on theI/O operations currently designated for pad 602. At step 1206, Iddqmessage 714 is also released to configuration control logic 710, whichprograms pad 602 to measure leakage as previously discussed. Afterwards,the control flow ends as indicated at step 1295.

As shown, if pad 602 is operating as an input pad, pad timing controller704 receives pad data 726 from pad 602. The delay select message 720instructs pad timing controller 704 to buffer the pad data 726 for aprescribed time period before sending the data to its destination asinternal data 728. The prescribed time period is substantially the sameas the path delay at other pads 602.

Conversely, if pad 602 is operating as an output pad, pad timingcontroller 704 receives internal data 728 and buffers the data for aprescribed time period before enabling it to be output as pad data 726.

FIG. 8 represents the buffering process for implementing path delayaccording to an embodiment of the present invention. As shown, padtiming controller 704 includes a plurality of buffers 802 a-802 n and amultiplexer 804. Data enters pad timing controller 704 and is delayed inone or more buffers 802 a-802 n for a prescribed time period. Theincoming data can be pad data 726 received by pad 602, or internal data728 received from another portion of transceiver 100.

Each buffer 802 a-802 n delays the incoming data a fixed delay time. Thedelay time is fixed internally. In other words, the system designerspecifies the delay time for the buffers during fabrication oftransceiver 100, and this value is not changed by the control registers702 or a system operator. The data is sent to the next buffer 802 a-802n unless multiplexer 804 opens the communications path to receive thedata. The delay select message 720 determines when multiplexer 804 opensthe communications path. The communications path can be opened prior tothe data entering one of the buffers 802 a-802 n, or at any point afterthe data is released from one of the buffers 802 a-802 n. Therefore, thedelay select message 720 enables the path delay to be increased ordecreased by specifying the number of buffers 802 a-802 n, if any, thatthe data should traverse. Once the data is received by multiplexer 804,the data is sent to its destination as pad data 726 or internal data728.

Hence, the multi-port SERDES transceiver 100 includes the ability tochange the timing of parallel ports 102 and serial ports 104. Thisincludes the ability to change the timing between the data and clocksignals. In other words, the registers in the parallel ports 102 andserial ports 104 can be re-programmed to operate at different timingprotocols. Referring to FIG. 13, flowchart 1300 provides an example of ageneral operational flow for changing the timing protocol for a pad 602.

The control flow of flowchart 1300 begins at step 1301 and passesimmediately to step 1303. At step 1303, one or more parameters are inputto adjust the path delay. Referring back to FIG. 7, the parameters areentered at programmable control registers 702.

At step 1306, the delay parameters are communicated to PAD timingcontroller 704. Referring back to FIG. 7, the delay parameters areencoded in delay select message 720.

At step 1309, the delay parameters (i.e., delay select message 720) areexecuted to specify the total delay period for the path delay. Asdiscussed with reference to FIG. 8, the total delay period is measuredby the quantity of buffers 802 a-802 n that data must traverse beforebeing received by multiplexer 804.

At step 1312, data (i.e., PAD data 726 or internal data 728) isreceived, and at step 1315, the data is delayed the specified totaldelay period. At step 1318, the data is sent to its destination.Afterwards, the control flow ends as indicated at step 1395.

As discussed with reference to FIG. 6, each MDIO pad 606 a-606 d isprogrammable to configure itself to comply with a designated electricalstandard, such as IEEE 802.3™ clause 22, IEEE 802.3™ clause 45, or thelike. For instance, IEEE 802.3™ clause 22 specifies the access tomanagement scheme, including data protocol and electrical requirements.

Pads 602 a-602 d are programmable to support any combination of dataprotocols (e.g., XGMII, TBI, RTBI, etc.) and electrical specifications.(e.g., HSTL, SSTL, LVTTL, etc.), and the electrical requirements aredetermined by the designated electrical specification. For example, theSSTL electrical specification requires pads 602 a-602 d to operate at2.5 volts. The HSTL electrical specification requires pads 602 a-602 dto operate at 1.5 volts or 1.8 volts. The LVTTL electrical specificationrequires pads 602 a-602 d to operate at 2.5 volts or 3.3 volts.

Notwithstanding the electrical requirements for pads 602 a-602 d, MDIOpads 606 a-606 d must operate at 1.2 volts to comply with IEEE 802.3™clause 45. To comply with IEEE 802.3™ clause 22, MDIO pads 606 a-606 dmust operate at 2.5 volts. Accordingly, MDIO pads 606 a-606 d areprogrammable to configure themselves and their associated pads 602 a-602d to comply with the appropriate electrical requirements. For example,to comply with IEEE 802.3™ clause 45, the power connection to the MDIOpads (e.g., pads 606 c) and their corresponding input and output pads(e.g., 602 d and 602 c) must be broken to allow the MDIO pads to operateat 1.2 volts and the input/output pads to operate at 2.5 volts. Toenable the split voltage requirement to be implemented, a split-voltagebus structure is provided to connect the pads for transceiver 100 to abus. An embodiment of a split-voltage bus structure is illustrated inFIG. 9.

FIG. 9 illustrates power supply connections for MDIO pads 606 c-606 dand output pads 602 c, according to an embodiment of the presentinvention. The power supply connections include VDDO I/O supply 912,VSSO I/O supply 914, VSSC core supply 916, and VDDC core supply 918.MDIO pads 606 c-606 d are separated from output pads 602 c by splitvoltage structure 902 a-902 b. Structure 902 a-902 b breaks the powerbus VDDO I/O supply 912, which allows different electrical requirementsto be provided for MDIO pads 606 c-606 d and the adjacent output pads602 c. Hence, the power signals 904, data signals 906, clock signals908, and ground signals 910 for MDIO pads 606 c-606 d will not interferewith the electrical and data signals communicated from output pads 602c. The connection for the VSSO I/O supply 914, VSSC core supply 916, andVDDC core supply 918 is not broken by the structure 902 a-902 b.

Referring to FIG. 14, flowchart 1400 provides an example of a generaloperational flow for configuring a programmable pad (i.e., serial IOpads 604 a-604 d, parallel 10 pads 602 a-602 d, and MDIO pads 606 a-606d) to comply with a specified electrical standard, such as IEEE 802.3™clause 22, IEEE 802.3™ clause 45, or the like.

The control flow of flowchart 1400 begins at step 1401 and passesimmediately to step 1403. At step 1403, MDIO instructions are accessedto identify the specified electrical specification (e.g., HHTL, SSTL,LVTTL, etc.). As discussed, the MDIO pad 606 must operate at a certainvoltage, depending on the specified electrical specification.

At step 1406, the MDIO instructions are executed to configure theelectrical requirements for the associated 10 pads 602 and/or 604. Asdiscussed, the IO pads 602 and/or 604 may be required to operate at adifferent voltage than the MDIO pad 606.

Once the electrical requirements have been configured, the controlpasses to step 1409. At step 1409, data and control signals are sent orreceived at the MDIO pad 606 and IO pads 602 and/or 604 in accordancewith the specified electrical specification. Afterwards, the controlflow ends as indicated at step 1495.

CONCLUSION

Example embodiments of the methods, systems, and components of thepresent invention have been described herein. As noted elsewhere, theseexample embodiments have been described for illustrative purposes only,and are not limiting. Other embodiments are possible and are covered bythe invention. Such other embodiments will be apparent to personsskilled in the relevant art(s) based on the teachings contained herein.Thus, the breadth and scope of the present invention should not belimited by any of the above-described exemplary embodiments, but shouldbe defined only in accordance with the following claims and theirequivalents.

1. A transceiver, comprising: a first port having a first programmablepad, the first programmable pad being configurable to operate accordingto a first specified electrical specification from among a plurality ofelectrical specifications and a first specified data protocol from amonga plurality of data protocols; and a second port having a secondprogrammable pad, the second programmable pad being configurable tooperate according to a second specified electrical specification fromamong the plurality of electrical specifications and a second specifieddata protocol from among the plurality of data protocols, wherein thefirst port and the second port are arranged on a substrate in arotational symmetric layout, the rotational symmetric layout of thesubstrate allowing the transceiver to maintain its functionality andconfiguration when rotated.
 2. The transceiver of claim 1, wherein thefirst port is a serial port and the second port is a parallel port, thefirst programmable pad and the second programmable pad forming part ofthe serial port and the parallel port, respectively.
 3. The transceiverof claim 1, further comprising: a bus configured and arranged tocommunicatively couple the first port and the second port.
 4. Thetransceiver of claim 3, wherein the bus is arranged to form a ringstructure around a central logic core.
 5. The transceiver of claim 1,further comprising: a pad control system constructed and arranged toconfigure the first programmable pad to operate in accordance with thefirst specified data protocol and the first specified electricalspecification and the second programmable pad to operate in accordancewith the second specified data protocol and the second specifiedelectrical specification.
 6. The transceiver of claim 5, wherein the padcontrol system comprises: an input controller to configure at least oneof a group consisting of: the first programmable pad and the secondprogrammable pad to receive at least one of a group consisting of: adata signal and a control signal.
 7. The transceiver of claim 5, whereinthe pad control system comprises: an output controller to configure atleast one of a group consisting of: the first programmable pad and thesecond programmable pad to send at least one of a group consisting of: adata signal and a control signal.
 8. The transceiver of claim 1, whereinthe first port is configured to perform a parallel to serial conversionwhen the first port receives parallel data.
 9. The transceiver of claim1, wherein the first port is configured to perform a serial to parallelconversion when the first port receives serial data.
 10. The transceiverof claim 1, wherein at least one of a group consisting of: an operatingvoltage of the first programmable pad and an operating voltage of thesecond programmable pad is defined according to the specified electricalspecification.
 11. The transceiver of claim 1, wherein the first portand the second port are configured to either send or receive data afterhaving been configured to comply with the specified data protocol andthe specified electrical specification.
 12. The transceiver of claim 1,wherein the rotational symmetric layout of the substrate allows thetransceiver to be connected to another communications device in a firstposition or a second position, the first position being rotated from thesecond position, and wherein the transceiver is configured to connect tothe another communication in both the first position and the secondposition without having to reconfigure either device.
 13. A transceiverincluding a serial port and a parallel port, comprising: a firstprogrammable pad configured and arranged to foam part of the serialport; and a second programmable pad configured and arranged to form partof the parallel port, the first serial port and the parallel port beingarranged on a substrate in a rotational symmetric layout, the rotationalsymmetric layout of the substrate allowing the transceiver to maintainits functionality and configuration when rotated, wherein said firstprogrammable pad and said second programmable pad are configurable tooperate according to a plurality of electrical specifications and aplurality of data protocols.
 14. The transceiver of claim 13, furthercomprising: a bus configured and arranged to communicatively couple theserial port and the parallel port.
 15. The transceiver of claim 14,wherein the bus is arranged to form a ring structure around a centrallogic core.
 16. The transceiver of claim 13, further comprising: a padcontrol system constructed and arranged to configure the firstprogrammable pad to operate in accordance with the first specified dataprotocol and the first specified electrical specification and the secondprogrammable pad to operate in accordance with the second specified dataprotocol and the second specified electrical specification.
 17. Thetransceiver of claim 16, wherein the pad control system comprises: aninput controller to configure at least one of a group consisting of: thefirst programmable pad and the second programmable pad to receive atleast one of a group consisting of: a data signal and a control signal.18. The transceiver of claim 16, wherein the pad control systemcomprises: an output controller to configure at least one of a groupconsisting of: the first programmable pad and the second programmablepad to send at least one of a group consisting of: a data signal and acontrol signal.
 19. The transceiver of claim 13, wherein the serial portis configured to perform a parallel to serial conversion when the serialport receives parallel data.
 20. The transceiver of claim 13, whereinthe parallel port is configured to perforin a serial to parallelconversion when the parallel port receives serial data.
 21. Thetransceiver of claim 13, wherein at least one of a group consisting of:an operating voltage of the first programmable pad and an operatingvoltage of the second programmable pad is defined according to thespecified electrical specification.
 22. The transceiver of claim 13,wherein the serial port and the parallel port are configured to eithersend or receive data after having been configured to comply with thespecified data protocol and the specified electrical specification. 23.The transceiver of claim 13, wherein the rotational symmetric layout ofthe substrate allows the transceiver to be connected to anothercommunications device in a first position or a second position, thefirst position being rotated from the second position, and wherein thetransceiver is configured to connect to the another communication inboth the first position and the second position without having toreconfigure either device.